封装管理 30-50万

职位描述：

·         负责维持Montage所有产品的封装良率和封装工序的稳定性；

In charge of keeping stable and good performance of assembly yield and process control;

·         负责封装生产线的各项主要工程能力指标满足Montage产品的封装需求；

In charge of qualifying the capability of assembly engineering to meet product assembly requirement;

·         参与新产品的封装开发和考核；

To co-work with other group/department for new product developing & qualifying. To Co-work with assembly supplier to handle new product developing & qualifying;

·         参与解决生产过程中发生的异常，对异常批次进行处理；

To co-work with other group/department to handle abnormal case, resolve problem  and assess the risk of effected product during production assembly;

·         负责封装bonding图等图档的制定及及时更新；

In charge of generate, review and update document related to assembly process;

·         定期对供应商开展稽核。

In charge of regular audit for assembly supplier.

 

 

任职资格：

·         本科及以上学历、材料和微电子等相关专业；

At least bachelor degree, major in material or micro-electronic or other relative major

·         强烈的责任心和吃苦耐劳意识。

Responsibility and hardships and hard work.

·         三年及以上封装工艺或者封装项目管理经验。

Work experience at assembly process or assembly project is more than 3 years.

云计算芯片公司，主要产品DDR