· Responsible for building standard Cadence library, including schematic symbol and PCB footprint;
· Participate in technical evaluation during project development stages from layout point of view, including pin map location & fan-out, placement feasibility, providing reasonable stack-up,…;
· Work closely with EE/ME/Packaging Engineer, performing PCB layout of high speed/analog/mixed signal PCBs for EVB boards;
· Follow the PCB/DFM/DFT design guideline to set up constraints;
· Responsible for the design releases required generation of artwork files, ODB++, and electronic PCB documentation;
· Your designs will need to follow SI/PI constraints, EMI control and FCC, UL and European regulations, IPC specifications
Preferred Qualifications:
· College degree or above, major in electronics, communication, etc;
· Be familiar with Cadence SCH/PCB tool (17.2/17.4);
· Above 5 years of design experience, be able to finish the project independently, have good high-speed multilayer board layout experience;
· Having detailed knowledge of circuit design and consideration for layout, routing, and timing constraints, DFM, DFT constraints in volume manufacturing is needed for this role;
· Deep understanding of high-speed/SI/PI;
· Strong background in PCB manufacturing processes for HDI, Standard Thru-Hole, and Back-drilling;
· Knowledge in IPC Class 3 PCB Design requirements is helpful;
· Teamwork spirit, good written English/simple spoken English;
· Self-motivation to learn cutting-edge technique;
· It is a plus if you have experience in crafting PCB's in the 25gbps + range using back-drilling technology. Also, designing sophisticated multi-layer HDI PCB's for very dense placement and routing is helpful.
